Experimental Investigation of Thermal and Humidity Dynamics in the Enclosures Made of Non-Permeable Walls

The usage of electronics in outdoor environment is growing therefore the control moisture related failures are becoming more important. main cause these humidity inside which may condense on surfaces or components. To protect from harsh environment, components and encapsulated by using enclosures, however it does not prevent ingress through plastic walls, gaskets, cable feedthroughs etc. Thus, to humidity, very important understand behaviour enclosures. Hence, paper concerns study temperature dynamics when enclosure exposed a cyclic condition according MIL-STD-810F. Two different enclosures were selected for experiment, namely, aluminum glass jar. was carried out climatic chamber measurements relative performed sensors. Different effect material considered ingress. In enclosure, results showed that difference between points smaller than case temperatures determined boundary conditions outside caused chamber.